All products are manufactured at Acies Leno site, using an SMD assembly line, capable of placing on average 7500 components per hour, taking into account our typical products, with peaks exceeding 20000. Only few operations are delegated to third parties.
Components range from 0402 chips to 0.4mm pitch QFP and packages like QFN, LGA and BGA. Maximum component size is 32mm x 32mm x 15mm.
Each manufactured unit is tested individually, and calibrated automatically, when needed. The results are stored into a database. For products like our battery monitors, this is especially important, as it allows to monitor production quality and keep trace of product life.